产品介绍

Product Introduction 

本产品在覆铜板行业中应用，能达到在环氧树脂及酚醛树脂最好的分散性和阻燃效果，一般填料的量为20%—30%最好，最大量不超过40%。该产品可广泛应用于CEM-1、CEM-3、FR-4等型号的覆铜板中。

When applied in the copper clad laminate (CCL) industry, this product can achieve the best dispersity and fire-retarding effect in epoxy resin and phenolic resin. It would be best for the filler quantity to be 20% - 30% generally, and the maximum quantity is not beyond 40%. The product can be widely applied in the CCLs of CEM-1, CEM-3, FR-4 and other models.

产品特点：

Product characteristics：

• 更高的耐热性，其分解温度在340℃，可满足高温（280℃焊锡温度）加工的要求；

Higher thermal resistance, being decomposed at 340°C to satisfy the high-temperature (280°C soldering tin temperature) processing requirement; 

• 成品在加工过程中的硬度有明显降低，有利于后钻孔等加工工序，对设备损耗小。

The hardness of the finished product reduces markedly in processing and this is advantageous to the subsequent processing procedures like drilling, etc., with a less equipment loss.

• 经活化处理的产品，在树脂体系中稳定性好，分散性能优，无团聚现象．

The product subject to activated treatment is stable in a resin system, which is excellent in dispersity and free from agglomeration.   

• 优异的性价比，其价格是同规格ATH的一半，成本大幅降低。

Excellent cost performance with a price being only half of the ATH of the same specification, resulting in substantial cost reduction.

产品规格：

Product specifications